Dewine Husted press release masthead newest
*FOR IMMEDIATE RELEASE:*
November 26, 2024
*MEDIA CONTACTS:
*Dan Tierney (GOV): 614-644-0957
Hayley Carducci (LG): 614-404-8616
Governor DeWine, Lt. Governor Husted Issue Statement on Intel CHIPS Act Agreement
(COLUMBUS, Ohio)— Ohio Governor Mike DeWine and Lt. Governor Jon Husted released the following statement today in response to the final approval of the CHIPS Act agreement between Intel and the federal government:
“Today’s announcement that Intel-Ohio is receiving CHIPS Act funding is a much-needed step forward in the important objective of making the most advanced computer chips in America. The DeWine-Husted Administration has never wavered in its pledge to bring these chip manufacturing plants to Ohio. The work to build the Silicon Heartland now moves forward with even more certainty, advancing our economic and national security to the benefit of the working people of Ohio and America.”
*-30-*
________________________________________________________________________
STAY CONNECTED: Visit us on Facebook [ [link removed] ] Visit us on Twitter [ [link removed] ] Visit us on YouTube [ [link removed] ] Visit us on Instagram [ [link removed] ]
SUBSCRIBER SERVICES:
Governor.Ohio.gov [ [link removed] ] | Unsubscribe [ [link removed] ] | Help [ [link removed] ]
Bookmark and Share [ [link removed] ]
________________________________________________________________________
This email was sent to
[email protected] using govDelivery Communications Cloud on behalf of: Governor DeWine Communications · Riffe Center, 30th Floor, 77 South High Street · Columbus, OH 43215-6117 GovDelivery logo [ [link removed] ]