FOR IMMEDIATE RELEASE:
November 26, 2024

MEDIA CONTACTS:
Dan Tierney (GOV): 614-644-0957
Hayley Carducci (LG): 614-404-8616

Governor DeWine, Lt. Governor Husted Issue Statement on Intel CHIPS Act Agreement

(COLUMBUS, Ohio)— Ohio Governor Mike DeWine and Lt. Governor Jon Husted released the following statement today in response to the final approval of the CHIPS Act agreement between Intel and the federal government:

“Today’s announcement that Intel-Ohio is receiving CHIPS Act funding is a much-needed step forward in the important objective of making the most advanced computer chips in America. The DeWine-Husted Administration has never wavered in its pledge to bring these chip manufacturing plants to Ohio. The work to build the Silicon Heartland now moves forward with even more certainty, advancing our economic and national security to the benefit of the working people of Ohio and America.”

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